As part of my usual round of build testing, output about missing
MAINTAINERS information was not logged, and thus often overlooked.
Correct that mistake by ensuring that I log the output of
genboardscfg.py every time. As part of that, address a number of
missing MAINTAINERS entires. In the case of a missing file, I have put
the original submitter down. In the rest of the cases I have added the
config (and sometimes relevant header file) to the existing set of file
globs.
Signed-off-by: Tom Rini <trini@konsulko.com>
Function enable_layerscape_ns_access() is alreayd called soc-wide.
Remove duplicated calling from individual boards.
Signed-off-by: Hou Zhiqiang <Zhiqiang.Hou@nxp.com>
[YS: Add commit message]
Reviewed-by: York Sun <york.sun@nxp.com>
The declarations should not be in common.h. Move them to the arch-specific
headers.
Signed-off-by: Simon Glass <sjg@chromium.org>
[trini: Fixup thinko defined(FSL_LSCH3) -> defined(CONFIG_FSL_LSCH3)]
Signed-off-by: Tom Rini <trini@konsulko.com>
Commit 088454cd dropped return value from initram(), setting
gd->ram_size directly. Three boards were missed for SPL boot.
Signed-off-by: York Sun <york.sun@nxp.com>
The PPA is a EL3 firmware, which support PSCI, hotplug,
power-management features etc.
Signed-off-by: Hou Zhiqiang <Zhiqiang.Hou@nxp.com>
Reviewed-by: York Sun <york.sun@nxp.com>
Using changes in this patch we were able to reduce approx 4k
size of u-boot-spl.bin image. Following is breif description of
changes to reduce SPL size:
1. Changes in board/freescale/ls1046ardb/Makefile to remove
compilation of eth.c and cpld.c in case of SPL build.
2. Changes in board/freescale/ls1046ardb/ls1046ardb.c to keep
only ddr_init and board_early_init_f funcations in case of SPL
build.
3. Changes in ls1046a_common.h & ls1046ardb.h to remove driver
specific macros due to which static data was being compiled in
case of SPL build.
4. Disable MMC driver from bieng compiled in case of SPL NAND
build and NAND driver from bieng compiled in case of SPL MMC build.
Signed-off-by: Vinitha Pillai <vinitha.pillai@nxp.com>
Signed-off-by: Sumit Garg <sumit.garg@nxp.com>
Reviewed-by: York Sun <york.sun@nxp.com>
This function name shadows a global name but is in fact different. This
is very confusing. Rename it to help with the following refactoring.
Signed-off-by: Simon Glass <sjg@chromium.org>
At present we cannot use this function as an init sequence call without a
wrapper, since it returns the RAM size. Adjust it to set the RAM size in
global_data instead, and return 0 on success.
Signed-off-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Stefan Roese <sr@denx.de>
It looks like only cm5200 and tqm8xx use this feature, so we don't really
need it in generic code. Drop it and have the users access gd->board_type
directly.
Signed-off-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Stefan Roese <sr@denx.de>
In early MMU table, DDR has to be mapped as device memory to avoid
speculative access. After DDR is initialized, it needs to be updated
to normal memory to allow code execution. To simplify the code,
dram_init() is moved into a common file as a weak function.
Signed-off-by: York Sun <york.sun@nxp.com>
For ARMv8 Layerscape SoCs, secure memory and MC memorey are reserved
at the end of DDR. DDR is spit into two or three banks. This patch
reverts commit aabd7ddb and simplifies the calculation of reserved
memory, and moves the code into common SoC file. Secure memory is
carved out first. DDR bank size is reduced. Reserved memory is then
allocated on the top of available memory. U-Boot still has access
to reserved memory as data transferring is needed. Device tree is
fixed with reduced memory size to hide the reserved memory from OS.
The same region is reserved for efi_loader.
Signed-off-by: York Sun <york.sun@nxp.com>
Introduce board/freescale/common/Kconfig so that we have a single place
for CONFIG options that are shared between ARM and PowerPC NXP platforms.
Cc: York Sun <york.sun@nxp.com>
Signed-off-by: Tom Rini <trini@konsulko.com>
Reviewed-by: York Sun <york.sun@nxp.com>
LS1046AQDS Specification:
-------------------------
Memory subsystem:
* 8GByte DDR4 SDRAM (64bit bus)
* 128 Mbyte NOR flash single-chip memory
* 512 Mbyte NAND flash
* 64 Mbyte high-speed SPI flash
* SD connector to interface with the SD memory card
Ethernet:
* Two XFI 10G ports
* Two SGMII ports
* Two RGMII ports
PCIe: supports Gen 1 and Gen 2
SATA 3.0: one SATA 3.0 port
USB 3.0: two micro AB connector and one type A connector
UART: supports two UARTs up to 115200 bps for console
Signed-off-by: Shaohui Xie <Shaohui.Xie@nxp.com>
Signed-off-by: Mingkai Hu <mingkai.hu@nxp.com>
Signed-off-by: Gong Qianyu <Qianyu.Gong@nxp.com>
Reviewed-by: York Sun <york.sun@nxp.com>
Tom Rini
Madalin Bucur
Hou Zhiqiang
Simon Glass
York Sun
Sumit Garg
Shengzhou Liu
Shaohui Xie