It can be optimised out by the compiler otherwise resulting
in obscure errors like a board not booting.
This has been documented in README since 2006 when these were
first fixed up for GCC 4.x.
Signed-off-by: John Rigby <john.rigby@linaro.org>
Fix some additional places.
Signed-off-by: Wolfgang Denk <wd@denx.de>
Acked-By: Albert ARIBAUD <albert.aribaud@free.fr>
This patch switches from the legacy mmc driver to the new generic mmc driver
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
The IGEP module is a low-power, high performance production-ready
system-on-module (SOM) based on TI's OMAP3 family.The IGEP module
solution based upon TI OMAP3 provides a low-power/low-cost platform
for a variety of consumer/industrial/medical devices.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
John Rigby
Enric Balletbo i Serra
Enric Balletbo i Serra
Vaibhav Hiremath