Even when the IGEPv2 board and the IGEP Computer-on-Module
are different from a form factor point of view, they are
very similar in the fact that share many components and how
they are wired.
So, it is possible (and better) to have a single board file
for both devices and just use the CONFIG_MACH_TYPE to make
a differentiation between each board when needed.
This change avoids code duplication by removing 298 lines of
code and makes future maintenance easier.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Acked-by: Igor Grinberg <grinberg@compulab.co.il>
The top level Makefile does not do any recursion into subdirs when
cleaning, so these clean/distclean targets in random arch/board dirs
never get used. Punt them all.
MAKEALL didn't report any errors related to this that I could see.
Signed-off-by: Mike Frysinger <vapier@gentoo.org>
Before this commit, weak symbols were not overridden by non-weak symbols
found in archive libraries when linking with recent versions of
binutils. As stated in the System V ABI, "the link editor does not
extract archive members to resolve undefined weak symbols".
This commit changes all Makefiles to use partial linking (ld -r) instead
of creating library archives, which forces all symbols to participate in
linking, allowing non-weak symbols to override weak symbols as intended.
This approach is also used by Linux, from which the gmake function
cmd_link_o_target (defined in config.mk and used in all Makefiles) is
inspired.
The name of each former library archive is preserved except for
extensions which change from ".a" to ".o". This commit updates
references accordingly where needed, in particular in some linker
scripts.
This commit reveals board configurations that exclude some features but
include source files that depend these disabled features in the build,
resulting in undefined symbols. Known such cases include:
- disabling CMD_NET but not CMD_NFS;
- enabling CONFIG_OF_LIBFDT but not CONFIG_QE.
Signed-off-by: Sebastien Carlier <sebastien.carlier@gmail.com>
The IGEP module is a low-power, high performance production-ready
system-on-module (SOM) based on TI's OMAP3 family.The IGEP module
solution based upon TI OMAP3 provides a low-power/low-cost platform
for a variety of consumer/industrial/medical devices.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
Add BeagleBoard support, common power code and README.
Signed-off-by: Jason Kridner <jkridner@beagleboard.org>
Signed-off-by: Dirk Behme <dirk.behme@googlemail.com>
Modifications are based on the linux kernel approach and
support two use cases:
1) Add O= to the make command line
'make O=/tmp/build all'
2) Set environement variable BUILD_DIR to point to the desired location
'export BUILD_DIR=/tmp/build'
'make'
The second approach can also be used with a MAKEALL script
'export BUILD_DIR=/tmp/build'
'./MAKEALL'
Command line 'O=' setting overrides BUILD_DIR environent variable.
When none of the above methods is used the local build is performed and
the object files are placed in the source directory.
- remove trailing white space, trailing empty lines, C++ comments, etc.
- split cmd_boot.c (separate cmd_bdinfo.c and cmd_load.c)
* Patches by Kenneth Johansson, 25 Jun 2003:
- major rework of command structure
(work done mostly by Michal Cendrowski and Joakim Kristiansen)